摘要
主要介绍了电子元器件引线的表面镀层采用纯Sn、Sn—Cu、Sn—Bi、Ni/Pd和Ni/Pd/Au五种无铅镀层的发展,分析了各自的优缺点,着重讨论了无铅镀层的表面形貌对焊接性的影响,以及无铅镀层与目前钎焊工艺的兼容性,并对无铅镀层的发展和应用进行了展望。
The development of five lead - free coatings was introduced such as pure Sn, Sn - Cu, Sn - Bi, Ni/Pd and Nil Pd/Au applied in coating electronic components/devices lead frame and the advantages and disadvantages of these coatings were analyzed. The influence of surface morphology of lead - free coating on solderability as well as the compatibility between lead - free coatings and soldering technology at present was discussed, and the development and application of lead - free coating in electronic industry were also forecasted.
出处
《焊接》
北大核心
2005年第9期5-9,共5页
Welding & Joining
