摘要
焊料从有铅向无铅转换中,不可避免会遇到二者混合使用的情况,有必要对生成的混合焊点进行可靠性研究。通过对不同工艺参数下形成的混合焊点和无铅焊点进行了外观检测、X射线检测和温度循环测试。结果显示,只要工艺参数控制得当,混合焊点是可行的。在焊球合金、焊料合金、峰值温度、液相线以上时间和焊接环境五个关键因素中,前四项对焊点可靠性比较重要,焊接环境对焊点可靠性的影响不很显著。
In the transition, solder from lead to lead-free, there is expected to be a period when the lead and lead-free will be mixed used, so it is necessary to study the reliability of the mixed solder joints. Through appearance testing, X 射线testing and temperature cycling testing, the reliability of mixed solder joints and 无铅 solder joints which formed under various process parameters was assesed. The results show that the mixed solder joints are feasible when the process parameters are controlled properly. In the five key factors of solder ball alloy, solder paste alloy, peak temperature, the time above liquidus and soldering environment, the fore four factors are more important than soldering environment to the solder joints reliability.
出处
《电子元件与材料》
CAS
CSCD
北大核心
2007年第6期24-27,共4页
Electronic Components And Materials
基金
国家自然科学基金资助项目(60666002)
关键词
电子技术
BGA
混合焊点
无铅焊点
可靠性
失效
electron technology
BGA（ball grid array package）
mixed solder joints
无铅 solder joints
reliability
failure
