摘要
研究了在SnAgCu、SnAgBi、SnZn三个系列无铅焊料中添加质量分数为0.1%的高熔点金属(Ni、Co、Fe)对其熔融特性、力学基本性能和浸润性的影响.结果表明,添加微量高熔点金属对焊料的熔融特性影响小于2%. 添加微量Ni能明显改善SnAgCu系和SnZn系焊料的力学性能,并能使SnAgBi系焊料在铜表面的接触角降低约10%～14%.添加微量Co或Fe后的新焊料仅少部分性能指标有所提高,而部分性能参数则严重下降.
The lead-free solders by adding small amount of high melting point metals based on .SnAgCu, SnAgBi and SnZn solders were prepared respectively. The effects of additional high melting point metal, Ni, Co, Fe, on melting process, mechanical properties, and wettability of new solders were investigated. The results indicated that small amount of high melting point metals had less than 2% effect on melting properties of previous lead-free solders. The mechanical properties of SnAgCu and SnZn based alloys by adding Ni are much improved. And, the additional Ni in SnAgBi made the solder＇s contact angle decrease as much as 10%-14% on Cu surface. However, only a few of properties of new solders are improved by adding Co or Fe, while some properties are heavily declined.
出处
《电子元件与材料》
CAS
CSCD
北大核心
2005年第9期48-51,共4页
Electronic Components And Materials
基金
APEC科技产业合作基金资助项目(中
美
日等多边合作环保型互连材料及其在微电子封装中的应用)
关键词
金属材料
无铅焊料
熔融特性
力学性能
浸润性
metal materials
lead-free solders
melting properties
mechanical properties
wettability
