摘要
在电子产品集成化程度高且小、轻、薄的发展趋势影响下,电子封装技术日趋重要。因此,该文从高密度封装所产生的一系列问题,以及对封装材料的新要求谈起,对陶瓷材料、纳米复合材料及AlSiC金属基体复合(MMC)封装材料等封装新材料的结构性能、可靠性及封装效果等进行了讨论,并与传统封装材料进行了比较,并探讨了这些封装新材料的发展和应用前景。
With the development of thin small outline electronic product, the technology of electronic packaging is more important gradually. Serial problems appeared due to the high-density packaging and the new demand of the packaging materials were reviewed. Comparing with the traditional material applied to the electronic packaging, the advantage of new material such as ceramics, nanomaterials and MMC and so on were discussed , in the aspects of structure, property, and packaging quality. Current status and prospect of application of new material were introduced.
出处
《印制电路信息》
2005年第1期10-13,38,共5页
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