摘要
金属化膜厚是影响高温共烧陶瓷电性能的重要因素之一。研究了高温共烧陶瓷钨金属化浆料粒度、丝网规格、印刷工艺参数和烧结温度对膜厚的影响。结果表明通过控制浆料中的金属颗粒粒径,提高印刷丝网丝径和涂布的感光膜层厚度,优化印刷刮刀移动速度和烧结温度可获得设计需要的金属化厚膜层。
Metallization film was an important factor of electricity capability on micro-electric ceramic packages. Effects of metallization paste, wire diameter, photo-sensitive film, screen printing speed and sintering temperature on metallization film were researched in this paper. We developed the metallization using controlled diameter of metallization paste＇s powder, increased wire diameter of silk screen, thickness of photosensitive emulsion, optimized screen printing speed and sintering temperature.
作者
唐利锋
程凯
庞学满
张鹏飞
TANG Lifeng;CHENG Kai;PANG Xueman;ZHANG Pengfei(Nanjing Electronic Devices Institute,Nanjing 210016,China)
出处
《电子与封装》
2018年第10期1-3,16,共4页
Electronics & Packaging
关键词
金属化膜厚
高温共烧陶瓷
丝网印刷
烧结温度
thickness of metallization film
high temperature co-fired ceramics
screen printing
sintering temperature
