摘要
分析比对了有铅和无铅两种焊料的不同温度特性。针对军工产品经常面对的有铅和无铅BGA同时组装在一块印制板上的情况,提出了有铅和无铅BGA混合组装的工艺难点。通过工艺试验列举了混合组装中各个环节所应注意的要点,强调要加强过程控制。最后利用各种可靠性试验和分析证明了混合组装焊点的可靠性。
Analyze and compare the temperature characteristics between lead and lead-free solder. Put forward the key points of assembly process of BGA with lead and lead-free materials when products are faced with the lead and lead-free BGA assembled on a printed board. List the key points which should pay attention during mixed assembly through test. Emphasize the process control. Finally, the reliability test and analysis show that the reliability of mixed solder joint is good.
出处
《电子工艺技术》
2012年第2期82-85,共4页
Electronics Process Technology
关键词
BGA
有铅
无铅
电子组装
可靠性
BGA
Lead
Lead-free
Electronic assembly
Reliability
