摘要
选取不同激光钎焊工艺参数,利用半导体激光软钎焊系统对Sn-Ag-Cu无铅钎料在铜基板上进行了钎焊试验,并研究了Sn-Ag-Cu焊点显微组织中金属间化合物形成规律。结果表明,当激光钎焊时间选择为1s,激光输出功率为38.3W时,焊点力学性能最佳。随着激光工艺参数的改变,焊点显微组织发生相应的变化。当使用最佳激光工艺参数钎焊时,形成的焊点晶粒细小,避免了焊点内金属间化合物Cu6Sn5的过度生长,此外还形成了厚度适中的金属间化合物层。对比试验结果发现,激光软钎焊方法比传统红外再流焊所形成的金属间化合物层更为平缓,能够获得力学性能更为优良的焊点。
Using different diode-laser soldering parameters,soldering experiments of Sn-Ag-Cu lead-free solder was carried out on Cu substrate using diode-laser soldering system,and the forming rules of the intermetallic compound were also analyzed in Sn-Ag-Cu soldered joints.The results show that,when the laser soldering time is 1s and the laser output power is 38.3 W,the mechanical properties of soldered joints are the best.With the change of laser soldering parameters,microstructures of soldered joints are relevantly changed.With the optimum laser soldering parameters,microstructures of soldered joint are fine and no excessive grow of Cu6Sn5 intermetallic compound,and the appropriate thickness of Cu6Sn5 layer is also got.Competitive experiments results show the intermetallic compound layer with laser soldering system is smoother than that with the IR soldering method,and the excellent mechanical properties can be abtained for the soldered joints.
出处
《焊接学报》
EI
CAS
CSCD
北大核心
2008年第2期22-26,共5页
Transactions of The China Welding Institution
基金
江苏省普通高校研究生科研创新计划资助项目(CX07B087z)
江苏省"六大人才高峰"资助项目(06-E-020)
关键词
半导体激光软钎焊
无铅焊点
金属间化合物
显微组织
diode laser soldering
lead-free soldered joint
intermetallic compound
microstructure
