摘要
采用微焊点强度测试仪测试了不同引脚数方形扁平式封装(QFP)微焊点的抗拉强度,研究了QFP的引脚数、钎料成分对其力学性能的影响,并采用扫描电镜对微焊点断裂处的显微组织进行了分析。结果表明,在相同引脚数的条件下,SnAgCu钎料的微焊点抗拉强度大于Sn-Pb钎料的微焊点抗拉强度;在钎料成分相同时,48引脚数的QFP微焊点强度小于100引脚数的QFP微焊点强度。
The tensile strength of QFP was tested by micro-joint tester and the effects of pitch numbers, solder paste composition on the mechanical properties of QFP soldered joint were studied in this paper. The fracture micrograph of joint was also analyzed by means of SEM and the results indicate that for the same pitch numbers, the tensile strength of the QFP soldered joint with SnAgCu solder paste is larger than that with Sn-Pb solder paste. With the same solder paste composition, the tensile strength of the QFP soldered joint with 48 pitchs is lower than that with 100 pitchs.
出处
《焊接学报》
EI
CAS
CSCD
北大核心
2005年第10期72-74,共3页
Transactions of The China Welding Institution
关键词
方形扁平式封装
微焊点
抗拉强度
Effects
Electronics packaging
Fracture
Mechanical properties
Scanning electron microscopy
Soldered joints
Tensile strength
