摘要
采用润湿平衡法研究了新型无铅钎料Sn2.5Ag0.7CuxRE对表面贴装元件的润湿性能。通过正交试验分析表明,钎焊温度对润湿力起显著作用,当采用水基免清洗助焊剂时,Sn2.5Ag0.7CuxRE无铅钎料合金钎焊的最佳工艺参数分别为:预热时间15 s、钎焊温度250℃和钎焊时间3 s。与两种商业应用的无铅钎料的润湿性能的比较表明,在该工艺条件下,Sn2.5Ag0.7CuxRE无铅钎料合金的润湿性能可略优于商用钎料,表明该钎料在选择合适的钎焊参数和钎剂后,可以满足表面组装行业对无铅钎料润湿性能的要求。
The wetting property of a new type lead- free solder alloy of Sn2.5Ag0.7CuxRE on Surface Mount Component(SMC) was researched by wetting balance method.The orthogonal test analysis shows that the soldering temperature plays a significant role on wetting force.When being adopted Water- based no- clean flux,the optimum soldering process parameters of Sn2.5Ag0.7CuxRE lead- free solder alloy are the preheating time of 15 s,soldering temperature of 250 ℃ and soldering time of 3 s.The comparison of wetting force between the two commercial application solders Sn3.8Ag0.7Cu and Sn3.OAg0.5Cu shows that under same experimental conditions,the wetting force of Sn2.5Ag0.7CuxRE is no less than that of the commercial application solders,which means that by adopting proper soldering processing parameters and flux,Sn2.5Ag0.7CuxRE solder alloy can meet the wetting property standard to the lead- free solders of Surface Mount Technology(SMT)industry.
出处
《焊接》
北大核心
2014年第1期57-61,71,共5页
Welding & Joining
关键词
润湿平衡法
无铅钎料
润湿工艺参数
wetting balance method
lead-free solder
wetting progress parameters
