摘要
论述了国内外电子组装生产中无铅技术的现状及发展趋势。环境法规及市场对绿色产品的需求,是采用无铅生产技术的主要动力。讨论了无铅合金的选择及其基本思路,指出了无铅钎焊对电子组装生产工艺技术带来的变化,目前存在的工艺难点及需要解决的技术与质量管理问题。企业必须尽早建立实现无铅转变的时间表,应对无铅生产的挑战。
Current status and trend of lead-free technology have been reviewed for electronic assembly manufacturing at home and abroad. The prime driving force adopting lead-free technology is the legislation and marketing advantage of green products. Selection and guideline of lead-free alloys are discussed.The change in electronic assembly manufacturing is outlined when lead-free soldering is in use. The key technology and quality management problems are also given. Finally, it is indicated that companies should establish their own timescales for transition to lead-free soldering to face the challenge of lead-free manufacturing.
出处
《电子工艺技术》
2005年第1期6-9,20,共5页
Electronics Process Technology
基金
863国家高技术研究发展计划支持(No.2002AA322040)。
关键词
无铅钎焊
电子组装
生产技术
Lead-free soldering
Electronic assembly
Manufacturing technology
