摘要
随着电子电镀工业的飞速发展,镀层质量的要求也越来越高,尤其是在可焊性方面更为突出。研究了一种环保型的电镀工艺,获得的锡银合金镀层具有很好的可焊性,而且该镀液的稳定性相当好,为可焊性镀层的发展提供了一个新的方向。
With the rapid development of electronic electreplating industry, there are increasingly stringent requirements on the quality of the claddings, especially on the weldability. An environment-friendly plating process is developed. The weldability of the tin-silver alloy cladding is very nice, and the stability of the plating solution is very good. It provides a new direction for the development of weldable claddings.
出处
《电镀与环保》
CAS
CSCD
2005年第6期6-7,共2页
Electroplating & Pollution Control
关键词
甲基磺酸
锡银合金
电镀
methylsulfonic acid
SwAg alloy
electroplating
