摘要
微电子机械系统(MEMS)的发展对目前的加工工艺提出了很大的挑战,键合技术是微机械加工中的重要技术之一.由于对键合温度和键合表面的要求较低,金-金热压键合在MEMS器件的在加工中受到越来越多的重视.金-金热压键合工艺包括金属化前处理、表面金属化、金属表面处理及热压键合几个步骤,文中对影响键合效果的因素进行分析.在分析的基础上采用苏斯公司的MA6/BA6键合台在300℃的键合温度下进行键合实验,键合强度达到体硅的强度,并以金-金热压键合工艺为基础,制作出THz波导和微机械谐振器.
The development of MEMS raised important challenges to the existing fabricate technology, bonding is very important for the fabrication of complex three-dimensional MEMS devices. Au-Au thermal-compress bonding has low requirement for surface quality and the temperature for bonding process is low too. The process of Au-Au thermal-compress bonding is detailed in the paper. The process includes wafer cleaned process before sputtering, metallization process, Au surface treatment and bonding. With Suss ＇ MA6/13A6 at 300 ℃, experiments ofAu-Au thermo-compress bonding was accomplished, the bonding strength reaches bulk silicon. MEMS THz waveguide and MEMS resonator using Au-Au thermal-compress bonding was introduced in the paper.
出处
《河北工业大学学报》
CAS
北大核心
2014年第2期17-20,共4页
Journal of Hebei University of Technology
基金
河北省科技计划(13210407)
河北省教育厅2013年度河北省高等学校科学研究计划(QN20132023)
石家庄市科技计划(131110641A)
石家庄学院博士基金(11BJ006)
