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热处理对离子束溅射Ni-Cr薄膜性能和结构的影响 被引量:2

Influence of rapid thermal process on the structure and properties of Ni-Cr thin-films fabricated by ion beam sputtering
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摘要 采用低能离子束溅射技术制备Ni-Cr合金薄膜,并对Ni-Cr合金薄膜进行快速热处理。用小角度X射线衍射仪、扫描电镜、原子力显微镜、α-台阶仪、四探针仪等测量薄膜的结构、形貌、厚度及电子学特性。研究结果表明:采用低能离子束溅射技术结合快速热处理工艺可以制备性能优良的Ni-Cr合金薄膜,薄膜的厚度与溅射时间呈正比;经过350℃及以上温度快速热处理后,溅射非晶态Ni-Cr合金薄膜发生晶化;溅射态合金薄膜方块电阻与溅射时间呈反比;薄膜方块电阻随热处理温度的升高而降低,经450℃/600 s热处理后薄膜方块电阻不发生变化。 Ni-Cr alloy thin-films were fabricated by low-energy ion beam sputtering technology, and the rapid thermal process was adopted for the as-deposited films. The structure of the films was confirmed by low angle X-ray diffraction. And the surface topography was characterized by scanning electron microscope and atom force microscope, respectively. The film thickness was measured with Alpha-step IQ surface profiler. The sheet electrical resistance of the films was measured with SDY-4D four-point probe. The results show that the combined processes of ion beam sputtering and rapid thermal process are effective for fabrication of Ni-Cr alloy thin-films with good properties. The relationship between thickness and sputtering time is linear. During the rapid thermal process up to 350 ℃, there are some transformation processes from amorphous to crystalline state in the films. For the as-deposited films, the sheet resistance is of inverse proportion function as the sputtering time. The films' sheet resistance decreases with the increase of temperatures in rapid thermal process, and it is steady after rapid thermal process of 450 ℃/600 s.
出处 《中南大学学报(自然科学版)》 EI CAS CSCD 北大核心 2006年第5期837-840,共4页 Journal of Central South University:Science and Technology
基金 国家自然科学基金资助项目(项目号60371046)
关键词 离子束溅射技术 纳米Ni-Cr合金薄膜 快速热处理工艺 ion beam sputtering technology Ni-Cr alloy thin-films rapid thermal process
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