摘要
电路器件的集成度越来越高,热流密度的大小也随之增加.温度和热应力是引起电路板功能失效的重要原因,因此利用有限元COMSOL多物理场仿真软件分析电路板在稳态下的温度分布和热应力分布,找出了电路最大可能的失效区域.研究结果表明:在电阻层电流密度越高的位置,加热功率越大,在电路曲线的内角,产生了最大的有效应力;电阻层和基板之间最大界面应力大于界面处粘附层上的有效力时,电路板就会毁坏;在加热电路的中间区域温度最高,由范式(Von Mises)有效应力产生的最大挠度也在电路的中间区域;基板厚度的降低可以有效地减少有效应力和挠度.本研究结果可应用于电路工作寿命和可靠性的分析,具有重要的理论和实际意义.
The integration of circuit devices is getting higher and higher,and the heat flux density is also increasing.Temperature and thermal stress was important causes of circuit board failure,therefore,the finite element COMSOL multiphysics software was used to analyze the temperature distribution and thermal stress distribution of the board under steady state,and the maximum possible failure area of the circuit was found out.The research results show that heating power is at the place where the higher current density in the resistive layer,and the largest effective stress is generated in the inner angle of the circuit curve.When the maximum interfacial stress between the resistive layer and the substrate is greater than the strength of the adhesive layer,the circuit board will be destroyed.The temperature in the middle of the heating circuit is the highest,and the maximum deflection generated by the effective stress of Von Mises is also in the middle of the circuit.The reduction in substrate thickness can effectively reduce effective stress and deflection.It has great theoretical and practical significance for the application of circuit working life and reliability analysis.
作者
夏丽
刘宪云
方佳怡
李磊
XIA Li;LIU Xianyun;FANG Jiayi;LI Lei(College of Mathematics and Physics,Changzhou University,Changzhou,Jiangsu,213000,CHN)
出处
《固体电子学研究与进展》
CAS
北大核心
2019年第4期306-311,共6页
Research & Progress of SSE
基金
教育部第46批留学回国人员科研启动基金资助项目(Nos.【2013】693)
国家自然科学基金资助项目(41875026)
