摘要
为了实现耐高温压力传感器SiC腔体的制作，分别利用高性能陶瓷胶、旋涂玻璃和金属Ni等3种材料作为键合层．研究了SiC—SiC键合工艺．扫描电子显微镜和键合拉伸强度实验结果表明，这3种材料的键合层均可以成功应用于SiC－SiC键合，其中高性能陶瓷胶键合层厚度为20—30μm，键合强度可达4 MPa；旋涂玻璃键合层厚度为2μm左右，键合强度约1．5 MPa；金属Ni键合层厚度为1μm，键合强度约为0．5 MPa．
To produce the high-temperature pressure sensor cavity by SiC, this paper describes a SiC-SiCbonding process using high-performance ceramic adhesive, spin-on glass and Ni, respectively. Test results show that the three materials can all be used in SiC-SiC bonding by scanning electron microscopeand tensile test for bonding strength. The thickness of the high-performance ceramic adhesive layer fallsin the range of 20--30 μm, and its maximum bonding strength is approximately 4 MPa. The thickness ofthe spin-on glass layer is approximately 2 μm, and its maximum bonding strength is characterized as 1.5MPa. The thickness of the Ni layer is approximately 1 μm, and its maximum bonding strength is 0. 5MPa. The three types of bonding processes show potential application in SiC based high-temperature pres-sure sensor.
出处
《纳米技术与精密工程》
CAS
CSCD
2014年第4期258-262,共5页
Nanotechnology and Precision Engineering
基金
国家自然科学基金资助项目(51205012)
关键词
碳化硅键合
陶瓷胶
键合强度
压力传感器
SiC bonding
ceramic adhesive
bonding strength
pressure sensor
