摘要
系统级封装SiP已成为突破摩尔定律的主要技术路线,是未来武器装备小型化和多功能化的重要依托,在武器装备研制和应用领域具有广阔的市场和前景。针对区域信号目标识别系统轻量化、小型化、集成化、低功耗等要求,设计一种基于SiP技术的某分组件并为此开发一套自动化测试系统,通过该自动化测试系统对200多套产品进行试验,得出该产品性能稳定、可靠;轻量化、小型化、低功耗等要求也满足客户要求。
System level packaging SiP has become the main technical route to break Moore′s law.It is an important support for the miniaturization and multifunction of weapons and equipment in the future.It has a broad market and prospect in the field of weapons and equipment development and application.According to the requirements of lightweight,miniaturization,integration and low power consumption of regional signal target recognition system,a sub component based on SiP technology is designed,and an automatic test system is developed.Through the test of more than 200 products by the automatic test system,it is concluded that the performance of the product is stable and reliable;lightweight,miniaturization,low power consumption and other requirements also meet customer requirements.
作者
刘继祥
钱宏文
廖明勋
Liu Jixiang;Qian Hongwen;Liao Mingxun(China Electronics Technology Group Corporation No.58 Research Institute,Wuxi 214035,China)
出处
《电子技术应用》
2022年第7期34-39,共6页
Application of Electronic Technique
关键词
SiP技术
自动化测试
分组件
目标识别
SiP technology
automated testing
sub assembly
target recognition
