摘要
介绍了系统级封装(System in Package,SiP)技术,基于SiP技术设计了一款由FPGA、ARM、SRAM等裸芯片组成的微系统,介绍了微系统的工作原理,描述了产品的实现流程。该系统具有重量轻、体积小、功能齐全等优点。
The SiP(System in Package)is introduced.Based on the SiP technology,a microsystem composed of bare dies such as FPGA,ARM,SRAM is designed.The working principle of microsystem is introduced,and the implementation process of the product is described.The system has the characteristics of light weight,small volume and complete function.
作者
王福鑫
国凤娟
牛玉成
詹兴龙
Wang Fuxin;Guo Fengjuan;Niu Yucheng;Zhan Xinglong(Shandong Institute of Space Electronic Technology,Yantai 264003,China)
出处
《电子技术应用》
2018年第12期17-19,24,共4页
Application of Electronic Technique
