摘要
红外探测器是一种重要的红外器件,它由高密度阵列焊点的芯片与相同阵列焊点的基板倒装互连制造而成,其高精度的互连工艺对倒装焊机的调平和对位提出了更高的要求。本文针对该要求,结合自主研制的新型倒装焊机,从解决高精度互连工艺中关键的倒装焊机调平和对位问题出发,提出了多视场视觉系统的工作原理,设计方案和相应的视觉算法,能够满足实际生产需求。
As an important infrared device,the infrared detector is manufactured by interconnecting a chip with high-density array solder joints and a substrate with the same array solder joints basing on flip chip technology,which put forward higher requirement to the leveling and alignment of flip chip bonder.Aiming at this requirement,combining with the self-developed new type flip chip bonder,this paper proposes the working principle,design scheme and corresponding vision algorithm of multiple FOV vision system to solve the key problem of leveling and alignment in high-precision flip chip technology,and which can meet the needs of actual production.
作者
景灏
王瑞鹏
闫瑛
狄希远
Jing Hao;Wang Ruipeng;Yan Ying;Di Xiyuan(The 2nd Research Institute of CETC, Taiyuan Shanxi 030024, China)
出处
《山西电子技术》
2020年第2期10-12,35,共4页
Shanxi Electronic Technology
关键词
倒装焊机
多视场
视觉系统
调平
对位
flip chipbonder
multiple FOV
visionsy stem
leveling
alignment
