摘要
针对大规模集成电路器件发展的要求,提出了高精度倒装焊机研制的必要性。阐述了设备的结构功能及研制攻克的技术难点,有效地解决了第三代红外焦平面器件对倒装焊接的工艺要求,实现了芯片与基板的高精度对位、大焊接压力的精确控制,极大地提高了产品的适应性。
According to the requirements of the development of LSI devices,it is necessary to develop a high-precision flip chip bonder.The structure and function of the equipment and the technical difficulties in its development are described,the technology requirements of flip chip bonding for the third generation infrared focal plane devices are effectively solved,the high-precision alignment between the chip and the substrate and the precise control of large bonding pressure are realized,which greatly improves the adaptability of the product.
作者
狄希远
DI Xiyuan(The 2nd Research Institute of CETC,Taiyuan 030024,China)
出处
《电子工艺技术》
2020年第4期226-229,共4页
Electronics Process Technology
关键词
红外焦平面
倒装焊
机器视觉
对位精度
压力控制
infrared focal plane
flip chip bonding
machine vision
alignment precision
pressure control
