摘要
对半导体封装中的重要设备全自动高速固晶机的视觉定位系统进行了研究,并对视觉定位系统分别进行了硬件和软件设计,所设计的硬件系统主要由图像采集及预处理子系统、光学成像子系统、电机控制子系统构成。软件系统采用了面向对象的模块化设计方法进行了设计。并对模板学习、定位策略、像素-脉冲换算等内容分别进行了研究。实验结果表明该系统结构合理,满足设计要求,一个图像采集处理节拍控制在了50ms以内。
Based on the research on machine vision location system in die bonder which used in semiconductor package, the design of hardware and software were developeod. The hardware consists of Image acquisition and pre-process subsystem,Optical imaging subsystem,electromotor control subsystem, the software is to divide into modules, and comments on templatelearn,location tactic,pixel-pulse conversion in details. The result of experiment shows that the system have a reasonable structure, meet the need of design requirements, the one cycle time of image acquisition and process can be controlled in 50ms.
出处
《机械设计与制造》
北大核心
2008年第6期57-59,共3页
Machinery Design & Manufacture
基金
国家科技支撑计划资助项目(2006BAF02A07)
关键词
固晶机
视觉定位
半导体封装设备
Die bonder
Vision location
Semiconductor Package device
