摘要
倒装焊技术被越来越多地应用于微波组件和光电子器件等高频和高速电子产品的生产制造中。介绍了倒装焊机的功能要求。重点分析了复合精密定位平台和双面双视场光学系统的设计原理和系统设计方案。通过建立设计模型,提出一种实用的图像对位算法,经应用验证,该算法能满足系统的对位精度要求。
Flip Chip technology has been used widely in the manufacture of high frequency and high speed electric products,such as micro-wave module and photoelectric parts.Introduce the requirement of the function of Flip Chip Bonder.Analyze mainly the design principle and design project of the complex precision positioning platform and the dual planes dual FOV optical system.Put forward a practical image alignment algorithm based on setting up the design model.The algorithm can meet the precision requirement of aligning.
出处
《电子工艺技术》
2012年第1期41-44,59,共5页
Electronics Process Technology
基金
工信部技术创新基金项目(项目编号:JJ0935)
关键词
倒装焊
双面双视场光学系统
复合精密定位平台
图像对位算法
Flip Chip technology
Dual planes dual FOV optical system
Complex precision positioning platform
Image aligning algorithm
