摘要
借助ANSYS/workbench热仿真模块,进行印制板上主要发热芯片布局设计以及仿真分析,在此基础上对散热结构件进行了优化。通过仿真数据的分析,得到了比较理想的芯片布局方式,通过新增散热措施后散热问题也得到了改善。
The simulation module of the ANSYS/workbench is used to design and simulate the layout of the main heating chip on the printed circuit board.On this basis,the heat dissipation of the structure is optimized.Through the analysis of the simulation data,the ideal chip distribution method is obtained,and the heat dissipation problem is improved obviously by adding the area of the heat dissipation.
作者
徐强
谢春辉
王耀金
XU Qiang;XIE Chun-hui;WANG Yao-jin(Shanghai Radio Equipment Research Institute,Shanghai 200090,China)
出处
《制导与引信》
2018年第1期26-28,39,共4页
Guidance & Fuze
关键词
印制板
芯片
热仿真
printed circuit board（PCB）
chip
thermal simulation
