摘要
应用热分析技术 ,能在产品的设计阶段获得其温度分布 ,从而优化设计 ,提高产品可靠性 .介绍了现在流行的电子设备热分析软件 ,阐述了电子设备热分析软件在应用中面临的一些问题 ,并结合一简单实例 ,展示了电子设备热分析的全过程 ,对热分析软件应用中的部分难题提出了解决方案 .结果表明 :妥善处理好主要问题 ,则能够达到较高的热分析精度 。
The temperature field of a product can be picked up to optimize the design and to improve the reliability by the technology of thermal analysis in the phase of design. Based on the characters of thermal analysis software, some problems in their application are discussed. With a simple example, the whole process of thermal analysis is presented, and several application solutions are given. The results show that if the main problems are solved correctly, a good thermal analysis can be gained to meet the demands of engineering.
出处
《北京航空航天大学学报》
EI
CAS
CSCD
北大核心
2003年第8期737-740,共4页
Journal of Beijing University of Aeronautics and Astronautics
关键词
热分析
温度场
电子产品可靠性
电子设备
热模型
Computer aided analysis
Computer software
Reliability
Temperature distribution
Thermoanalysis
