摘要
在阐述电子设备热分析重要性的同时,介绍了当前流行的四种热分析软件,利用其中的Icepak软件对某电子设备的机箱进行了热分析,并通过调整机箱的结构分布及其散热方式,使其满足了热设计要求。通过算例也显示了Icepak软件在电子产品热设计中的优越性。
The importance of thermal analysis of electronic device is discussed and a brief introduction to four popular thermal analysis softwares is given. Then, the overall process of thermal analysis of some electronic devices with Icepak is shown in this paper. Through the analysis ,the configuration and the cooling system of the device are adjusted for fulfil the demands of thermal design. The advantages of Icepak in the thermal analysis of electronic products are also demonstrated.
出处
《电子机械工程》
2005年第1期14-16,共3页
Electro-Mechanical Engineering
