摘要
集成电路的热问题成为了集成电路设计所面临的挑战,必须研究与建立有效的热模型,从而在集成电路设计时为解决热问题提高解决方案。着重介绍了集成电路设计中所涉及到的热问题的最新研究进展,包括热分析、功耗与热的关系、高层次综合阶段考虑热、物理设计阶段热模型的建立及热问题的解决方案,如热通孔、电压岛技术及动态热量管理技术等。
The thermal problem is one of important challenge for VLSI design. The effective thermal model must be researched and created to solve the thermal problem. This paper introduces the latest advancement in VLSI therma-laware design, including the thermal analysis, relationship between power consumption, temperature-aware in high-level synthesis, resistive thermal model, unified high-level synthesis and physical design, creating thermal model and solutions for thermal problem, such as thermal vias, voltage islands and dynamic thermal management.
出处
《武汉理工大学学报》
EI
CAS
CSCD
北大核心
2008年第9期128-130,共3页
Journal of Wuhan University of Technology
基金
国家自然科学基金(60572015)
