摘要
随着电子设备性能和功能越来越强大,如何解决设备散热及生产工艺成为目前最重要的问题。而双组份灌封胶作为一种高效的散热材料成为目前有效解决电子设备散热问题的有效途径之一。另外灌胶工艺采用AB组份1:1抽真空搅拌混合、振动平台和模内灌胶的方法,这种散热方式和生产工艺既解决了电子设备的散热问题,又解决了生产工艺问题。文章主要讨论电子行业的散热材料应用和灌胶工艺技术。
With the increasingly powerful performance and functionality of electronic devices,how to solve equipment heat dissipation and production processes has become the most important issue at present.As an efficient heat dissipation material,dual component potting adhesive has become one of the effective ways to solve the heat dissipation problem of electronic equipment.In addition,the glue injection process adopts the method of AB component 1:1 vacuum mixing,vibration platform,and mold glue injection.This heat dissipation method and production process not only solve the heat dissipation problem of electronic equipment,but also solve the production process problem.This article mainly discusses the application of heat dissipation materials and glue injection technology in the electronic industry.
作者
郝红星
曹连毕
李资成
范红彬
HAO Hongxing;CAO Lianbi;LI Zicheng;FAN Hongbin(Hunan Giantsun power Electronics Co.,Ltd.,Chenzhou 423000,China)
关键词
灌封胶
散热应用
发展趋势
工艺
sealing adhesive
heat dissipation applications
development trends
workmanship
