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改性硅微粉对加成型有机硅灌封胶性能的影响 被引量:5

Effect of Modified Silicon Micropowder on Mechanical Properties of Polyaddition Silicone Encapsulant
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摘要 以甲基乙烯基聚硅氧烷为基料、含氢硅油为交联剂、硅烷偶联剂为填料改性剂、改性硅微粉为导热和补强填料制得加成型有机硅灌封胶。研究了硅烷偶联剂种类、改性硅微粉粒径和用量对有机硅灌封胶性能的影响。结果表明,随着改性硅微粉平均粒径由1μm增大到20μm,有机硅灌封胶的黏度由7712 mPa·s降至1520 mPa·s,热导率由0.64 W/(m·K)升至0.73 W/(m·K),拉伸强度由1.70 MPa降至1.60 MPa,拉断伸长率由100%降至45%,沉降物平均质量由8 g增加到61 g;随着改性硅微粉用量从0增加到300份,有机硅灌封胶的黏度从200 mPa·s升至2501 mPa·s,热导率从0.20 W/(m·K)升至1.05 W/(m·K),拉伸强度升高并趋于稳定,拉断伸长率先升后降;综合考虑,采用γ-氨丙基三乙氧基硅烷作填料改性剂、200份平均粒径10μm的改性硅微粉作导热和补强填料较佳,此时有机硅灌封胶的拉伸强度为1.65 MPa,拉断伸长率为75%,黏度为2010 mPa·s,热导率为0.65 W/(m·K),沉降物平均质量为35 g。 The polyaddition silicone encapsulant was prepared with methylvinyl polysiloxane as base material,hydrogen-containing silicone oil as the crosslinking agent,silane coupling agent as filler modifier and modified silicon micropowder as the thermal conductivity and reinforcing filler.The effects of the types of silane coupling agent,the particle size and the amount of modified silicon micropowder on the properties of silicone encapsulant were studied.The results show that with the increase of the average particle size of modified silicon micropowders from 1μm to 20μm,the viscosity of silicone encapsulant decreases from 7712 mPa·s to 1520 mPa·s,the thermal conductivity increases from 0.64 W/(m·K)to 0.73 W/(m·K),and the tensile strength decreases from 1.70 MPa to 1.60 MPa.The elongation at break decreases from 100%to 45%,and the mass of sedimentation increases from 8 g to 61 g.As the dosage of modified silicon powder increases from 0 to 300,the viscosity of silicone sealant increases from 200 mPa·s to 2501 mPa·s,the thermal conductivity increases from 0.20 W/(m·K)to 1.05 W/(m·K),the tensile strength increases and tends to be stable,and the tensile elongation first increases and then decreases.Comprehensively,γ-aminopropyl trethoxy silane is used as filler modifier and 200 phr modified silicon micropowders with average particle size of 10μm is used as thermal conductivity and reinforcing filler.At this time,the tensile strength of the silicone encapsulant is 1.65 MPa,the elongation at break is 75%,the viscosity is 2010 mPa·s,and the thermal conductivity is 0.65 W/(m·K),and the sediment mass is 35 g.
作者 刘廷铸 胡国新 赵志垒 黄永军 LIU Tingzhu;HU Guoxin;ZHAO Zhilei;HUANG Yongjun(Guangzhou Jitai Chemical Co.,Ltd.,Guangzhou 510000,Guangdong)
出处 《有机硅材料》 CAS 2022年第5期52-56,共5页 Silicone Material
关键词 加成型 灌封胶 硅烷偶联剂种类 改性硅微粉 拉伸强度 拉断伸长率 polyaddition encapsulant silane coupling agent modified silicon micropowder tensile strength elongation at break
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