摘要
实现集成电子产品回流焊接前,对回焊炉焊接区域中心温控曲线仿真,有助于选择适当的回焊工艺参数,提高回流焊接工艺整体效率及产品质量。根据热传导规律以及比热容公式,得到焊接区域中心温度曲线关于炉内温度分布函数在传送带位移上的一阶常微分方程,对于温差较小的间隙,使用Sigmoid函数,得到平滑的区间温度过渡曲线;对于温差较大的间隙,利用指数函数和一次函数进行线性组合,迫近实际凹函数,从而得到完整的炉内温度分布函数。通过求解常微分方程得到焊接参数,并通过计算预测温度场与真实温度分布数间的均方误差优化模型参数,得到一组符合制程界限的最优工艺参数。同时,根据上述建立的基于区域中心温度场预测方法,针对特定工业生产场景下的实际需求设计了一套回流焊接优化策略:给定温度参数下速度区间预测策略,锡膏融化回流面积最小参数区间预测策略,锡膏融化回流面积左右最对称参数区间预测。仿真结果表明采用以上方法得到的温度场预测结果与实际传感器数据高度吻合,具有极强的相关性。上述方法可以很好的帮助选择适当的工艺参数,优化生产过程,减少设备调试实践,优化生产产品焊点质量。
Before reflow soldering of integrated electronic products,the numerical simulation of temperature control curve of the reflow furnace is crucial for selecting proper parameters and improving the overall efficiency of the reflow soldering process and product quality.According to the heat conduction law and the specific heat capacity for-mula,the first-order ordinary differential equation of the central temperature curve of the welding area with respect to the temperature distribution function in the furnace on the conveyor belt displacement is obtained.For the gap with small temperature difference,the sigmoid function is used to obtain a smooth interval temperature transition curve.For the gap with large temperature difference,the linear combination of the exponential function and primary function is used to approach the actual concave function,so as to obtain the complete temperature distribution function in the furnace.The welding parameters are obtained by solving the ordinary differential equation,and a set of optimal process parameters consistent with the process boundary are obtained by calculating the mean square error between the predicted temperature field and the real temperature distribution.At the same time,according to the above estab-lished prediction method based on the regional center temperature field,a set of reflow optimization strategies are de-signed for the actual needs of specific industrial production scenarios:speed interval prediction strategy under given temperature parameters,minimum parameter interval prediction strategy of solder pastes melting reflow area,and the most symmetrical parameter interval prediction of solder paste melting reflow area.The simulation results show that the temperature field prediction results obtained by this method are highly consistent with the actual sensor data,and have strong correlation.This method can help to select appropriate process parameters,optimize the production process,reduce equipment commissioning practices and optimize the solder joint qual
作者
隋远
卜凡洋
邵子龙
闫伟
SUI Yuan;BU Fan-yang;SHAO Zi-long;YAN Wei(School of Information Science and Engineering,Shandong Normal University,Jinan Shandong 250014,China)
出处
《计算机仿真》
北大核心
2023年第5期299-303,340,共6页
Computer Simulation
基金
国家自然科学基金(62002207,62072290,62073201)
山东省自然科学基金(ZR2020MA102)。
关键词
回流焊接
炉温曲线预测
机理模型
常微分方程模型
工艺优化
Reflow soldering
Furnace temperature curve
Mechanism model
Ordinary differential equation mod-el
Process optimization
