摘要
本文主要讨论了温度曲线在电子产品回流焊接工艺中的应用,通过对使用工艺的分析检测,研究在表面贴装制造工艺中影响回流焊接质量的主要因素,如焊膏、搅拌焊膏、钢网厚度、PCB传输速度、各加热区温度、回流炉对流导热率以及回流炉技术参数稳定性等,得出比较贴切的参数值以供参考,提高工作效率,并针对性地提出工艺方法改善方向,优化生产工艺。
This paper mainly discusses the application of temperature curve in the reflow welding process of electronic products, and through the analysis and detection of the use process. The main factors affecting the quality of reflow welding in SMT manufacturing process, such as solder paste, stirred solder paste, steel mesh thickness, PCB transmission speed, heating zone temperature, convection heat conduction rate in reflow furnace and technical parameters stability of reflow furnace, are studied. Put forward the technological process to improve the direction and optimize the production process.
作者
宋会良
Song Huiliang(CAMA（Luoyang）measurement ＆ Control Co？,Ltd,Luoyang Henan,471009)
出处
《电子测试》
2018年第13期63-65,共3页
Electronic Test
关键词
回流炉
温度曲线
锡膏
表面贴装
reflow oven
temperature curve
Solder paste
SMT
