摘要
通过对SMT再流焊焊接过程中实测的一条温度曲线的研究,分析了温度曲线的各阶段对焊接质量的影响,总结了由不良温度曲线导致的常见焊接质量问题并对其产生原因进行了分析,为再流炉参数的设置提供了理论依据,从而避免了焊接过程中缺陷的发生保证了焊接质量。
Through the study of a measured temperature curve in a SMT reflow soldering process,the influence of temperature curves in different stages on the welding quality is analyzed in this paper and the reason affected the welding quality is the negative temperature curve.This research result provides a theoretical basis for reflow furnace parameter setting and avoided the defects to appear during the welding.
出处
《青海大学学报（自然科学版）》
2009年第2期13-15,共3页
Journal of Qinghai University(Natural Science)
关键词
SMT
再流焊
温度曲线
焊接质量
SMT
reflow soldering
temperature curve
welding quality
