摘要
回顾考察了迅速发展中SMT再流焊方法和工艺的发展及其研究现状,着重评价了国外制定再流焊工艺研究的技术水平,以及国内在制定再流焊工艺方面的状况和不足,最后展望了再流焊工艺的预测仿真对制定再流焊工艺的巨大影响和促进。
Review the development of reflow soldering and its process in SMT. Discuss the level of establishing reflow soldering process inside and abroad. The modeling and simulation will advance the development of reflow soldering process.
出处
《电子工艺技术》
2004年第6期234-238,共5页
Electronics Process Technology
关键词
SMT
再流焊
温度曲线
仿真
SMT
Reflow soldering
Profile
Simulation
