摘要
再流焊工艺是表面组装技术中的关键技术之一。利用ANSYS仿真软件建立SMA实体模型,进行材料参数等定义,根据受力分布情况智能划分网格,根据再流焊设定参数模拟SMA再流焊受热加载过程,并分析SMA整个再流焊过程的受热情况,最后对仿真结果进行分析,以确认该组再流焊参数是否符合实际要求。该研究可大大缩短再流焊工艺开发与准备时间,具有一定的应用价值。
The reflow soldering technologies are key technologies of surface mount technology （SMT）. The simulation process of reflow soldering is as follow：simulation model of surface mount assembly（SMA） is established by ANSYS software, the material parameters are defined. Intelligent divide grid based on actual stress distribution. According as the set working parameters, the heat generated loading of SMA is simulated in the process of reflow soldering. At last analyzing the results of simulation, whether the working parameters meet the requirement was judged. By this research the developing period of reflow soldering has been shortened. It has significant application value and military meaning.
出处
《电子工艺技术》
2009年第6期342-345,共4页
Electronics Process Technology
关键词
再焊
仿真过程
表面组装技术
Reflow soldering
Simulation process
Surface mount technology
