期刊文献+

大功率白光LED封装温度场模拟及材料优化 被引量:2

Simulation on temperature Held and materials optimization of high-power white LED package
下载PDF
导出
摘要 针对一种大功率白光LED照明灯具的封装构件进行热分析,通过有限元计算分析其在工作状态时的稳态温度场,发现LED封装整体的温度梯度比较大,此时LED芯片的温度为396K,灯罩为320K。通过实际测量计算得出LED的结温为394.5K,与数值模拟的结果基本吻合。封装陶瓷基板是阻碍器件散热的主要部分。为此,提出了几种优化方案,分别是采用不同的LED封装材料以及采用不同的铝热沉结构尺寸,并且进行了模拟对比。结果表明,同时采用Cu-Mo-Cu复合基板和铝热沉效果最佳,可使LED的结温降为336K,温差降为11K。 The thermal analysis of package products in a high-power white LED light fitting was investigated in this paper.According to the FEM calculation,the static temperature field in the working process was analyzed.The temperature gradient in the LED package structure was found.At steady-state,the temperature of the LED chip is 396 K,and that of LED lamp-chimney is 320 K.The temperature of the LED chip obtained from practical measurement and calculation is 394.5 K,which is accorded with that of simulation.Ceramic substrate was considered as the main part to block heat dissipation.Several optimization designs of different substrate materials and different Al heat-sink sizes of LED were put forward,and their simulation results were compared.The results show that the optimal result is achieved when both Cu-Mo-Cu composite substrate and Al heat-sink are used,and the temperature of the LED chip is decreased to 336 K,and the temperatures difference is decreased to 11 K.
出处 《焊接》 北大核心 2008年第6期2-5,共4页 Welding & Joining
关键词 封装 温度场 材料优化 package, temperature Field, materials optimization
  • 相关文献

参考文献6

二级参考文献11

  • 1李明雨.钎料液滴激光强迫超声振动及对钎料润湿的影响:[博士学位论文].哈尔滨:哈尔滨工业大学,2001.. 被引量:1
  • 2Arik M,Weaver S.Chip scale thermal management of high brightness LED packages[J].Proc of SPIE,2004,5 530:214-223. 被引量:1
  • 3Arik M,Beckerb C,Weaverb S et al.Thermal management of LEDs:Package to system[J].Proc SPIE,2004,5 187:64-75. 被引量:1
  • 4David G Pelka,Kavita Patel.An overview of LED applications for generalIllumination[J].Proc of SPIE,2004,5186:15-26. 被引量:1
  • 5Jen-Hau Cheng,Chun-Kai Liu,Yu-Lin Chao et al.Cooling performance of silicon-based thermoelectric device on high power LED[C].ICT05:24th international conference on thermoelectrics,south carolina USA,2005:53-56. 被引量:1
  • 6Kim Lan,Choi Jong Hwa,Jang Sun Ho et al.Thermal analysis of LED array system with heat pipe[J].Thermochimica acta,2007,455 (1):21-25. 被引量:1
  • 7Arik M,Petroski J,Weaver S.Thermal challenges in the future generation solid state lighting applications:light emitting diodes[C].ASME/ IEEEinternational packaging technical conference,Hawaii,2001:113-120. 被引量:1
  • 8李民,冯志刚.BGA/MCM进入现代组装技术的主流[J].电子工艺技术,1997,18(5):179-181. 被引量:5
  • 9田艳红,王春青.钎料球激光重熔温度场数值模拟[J].焊接学报,2001,22(2):75-78. 被引量:8
  • 10田艳红,王春青.激光重熔PBGA钎料球与Au/Ni/Cu焊盘的界面反应[J].金属学报,2002,38(1):95-98. 被引量:5

共引文献25

同被引文献22

引证文献2

二级引证文献5

相关作者

内容加载中请稍等...

相关机构

内容加载中请稍等...

相关主题

内容加载中请稍等...

浏览历史

内容加载中请稍等...
;
使用帮助 返回顶部