摘要
针对一种大功率白光LED照明灯具的封装构件进行热分析,通过有限元计算分析其在工作状态时的稳态温度场,发现LED封装整体的温度梯度比较大,此时LED芯片的温度为396K,灯罩为320K。通过实际测量计算得出LED的结温为394.5K,与数值模拟的结果基本吻合。封装陶瓷基板是阻碍器件散热的主要部分。为此,提出了几种优化方案,分别是采用不同的LED封装材料以及采用不同的铝热沉结构尺寸,并且进行了模拟对比。结果表明,同时采用Cu-Mo-Cu复合基板和铝热沉效果最佳,可使LED的结温降为336K,温差降为11K。
The thermal analysis of package products in a high-power white LED light fitting was investigated in this paper.According to the FEM calculation,the static temperature field in the working process was analyzed.The temperature gradient in the LED package structure was found.At steady-state,the temperature of the LED chip is 396 K,and that of LED lamp-chimney is 320 K.The temperature of the LED chip obtained from practical measurement and calculation is 394.5 K,which is accorded with that of simulation.Ceramic substrate was considered as the main part to block heat dissipation.Several optimization designs of different substrate materials and different Al heat-sink sizes of LED were put forward,and their simulation results were compared.The results show that the optimal result is achieved when both Cu-Mo-Cu composite substrate and Al heat-sink are used,and the temperature of the LED chip is decreased to 336 K,and the temperatures difference is decreased to 11 K.
出处
《焊接》
北大核心
2008年第6期2-5,共4页
Welding & Joining
关键词
封装
温度场
材料优化
package, temperature Field, materials optimization