摘要
采用高乙烯基含量的丁苯橡胶与3种不同含乙烯基结构的单体(助剂)作为覆铜层压板的树脂基体,研究了不同含量的丁苯橡胶对3种不同体系覆铜层压板性能的影响。结果表明:二乙烯基苯(DVB)体系的覆铜层压板介电性能最佳,最小介电常数和介电损耗分别达到3.33和0.002 4,同时吸水率最小为0.024%;三烯丙基异氰脲酸酯(TAIC)体系的覆铜层压板具有较高的玻璃化温度,最高可达248℃,同时弯曲强度最高为351 MPa。
Using high content of vinyl styrene-butadiene rubber with three different structure of vinyl monomer(additives) as the resin matrix of copper clad laminate. The effects of different content styrene butadiene rubber on the properties of three different systems of copper clad laminates were studied. The results show that the dielectric properties of copper clad laminates with DVB system were the best, the minimum dielectric constant and dielectric loss were 3.33 and 0.002 4, respectively, and the minimum water absorption was 0.024%. The copper clad laminates with TAIC system had higher glass transition temperature up to 248 ℃, and bending strength up to 351 MPa.
作者
段家真
金石磊
马峰岭
聂娅
李小慧
DUAN Jiazhen;JIN Shilei;MA Fengling;NIE Ya;LI Xiaohui(Shanghai Key Laboratory of Engineering Materials Application and Evaluation,Shanghai Research Institute of Materials,Shanghai 200437,China)
出处
《理化检验（物理分册）》
CAS
2021年第6期38-41,共4页
Physical Testing and Chemical Analysis(Part A:Physical Testing)
关键词
丁苯橡胶
乙烯基树脂
覆铜层压板
介电性能
styrene butadiene rubber
vinyl resin
copper clad laminate
dielectric property
