摘要
随着电子元器件、电力系统和通讯设备等领域的飞速发展,对散热要求也越来越高。六方氮化硼是一种性能优异的绝缘导热填料,其导热复合材料受到了越来越多的关注。该文综述了近年来关于六方氮化硼基导热复合材料的研究进展,简要介绍了其导热机理和研究现状,进一步总结了当前存在的一些技术困难,并展望了未来六方氮化硼基导热复合材料的发展方向。
Rapid development of electronic devices, power systems and communication equipments present an increasing requirement for the heat dissipation. Hexagonal boron nitride(h-BN) is very useful as an insulating and thermal conductive filler, and more and more attentions have been paid to its thermal conductive composites. In this article, we focus on the detail progress of h-BN-based thermal conductive composites, including thermal transfer mechanism and present situation. Furthermore, some current technical defects and difficulties are summarized, and the future developing trend of h-BN-based thermal conductive composites is also prospected.
作者
林正得
颜庆伟
代文
吕乐
谭雪
LIN Cheng-Te;YAN Qingwei;DAI Wen;LV Le;TAN Xue(Key Laboratory of Marine Materials and Related Technologies,Zhejiang Key Laboratory of Marine Materials and Protective Technologies,Ningbo Institute of Materials Technology and Engmeering,Chinese Academy of Sciences,Ningbo 315201,China)
出处
《集成技术》
2019年第1期24-37,共14页
Journal of Integration Technology
基金
国家重点研发计划项目(2017YFB0406000)
中国科学院科研仪器设备研制项目(YZ201640)
宁波市重大专项项目(2016S1002
2016B10038)
关键词
六方氮化硼
复合材料
导热性能
hexagonal boron nitride
composites
thermal conductivity
