摘要
导电胶粘接工艺是微组装工艺的重要手段之一,其粘接强度与导电性能是衡量粘接质量好坏的主要评价手段。铝作为常用微波组件的腔体材料,基板、元器件等大多采用粘接工艺对其进行键合。研究了某型导电胶在铝基腔体不同表面镀层状态上粘接强度和接地电阻之间的关系。实验结果表明,采用金或暗镍作为铝基腔体镀层材料,可有效提高导电胶的粘接强度并稳定接地电阻。
The bonding process of conductive adhesive is one of the important means of micro-assembly technology,and its bonding strength and conductivity are the main evaluation means to evaluate the bonding quality.Aluminum is commonly used as the cavity material of microwave components,and most of the substrates and components are bonded by bonding technology.The relationship between the bonding strength and grounding resistance of a conductive adhesive on different surface coating states of aluminumbased cavities is studied.The experimental results show that the bonding strength of conductive adhesive can be effectively improved and the grounding resistance can be stabilized by using gold or dark nickel as the coating material of aluminum based cavity.
作者
姚友谊
胡蓉
YAO Youyi;HU Rong(Chengdu Seekon Microwave Communication Co.,Ltd.,Chengdu 610091,China)
出处
《电子工艺技术》
2020年第5期274-277,共4页
Electronics Process Technology
基金
四川省级科技计划项目(2018GZ0116)。
关键词
镀层
导电胶
粘接强度
接地性能
coatings
conductive adhesive
bonding strength
grounding performance
