摘要
铜上化学镀Ni-P合金通常需要用钯催化剂或其它无钯催化剂催化后才能施镀,研究了利用水合肼为引发剂,以水合肼和次磷酸钠为还原剂的化学镀Ni-P合金液,在铜箔上直接施镀,铜箔无须镀前催化。利用扫描电镜和X-射线衍射仪研究了镀层的表面形貌,利用能谱仪测定了镀层中P含量,同时研究了水合肼和次磷酸钠的浓度对镀速和P含量的影响,探讨了无催化铜箔化学镀Ni-P合金的反应机理。
Ni-P coating cannt be deposited on copper unless copper was catalyzed with palladium catalyst or other catalysts before electroless nickel plating. Electroless nickel plating bath in which hydrazine was used as reaction initiator, hydrazine studied. Ni-P coating was deposited plating. Effect of hydrazine or ied. SEM and XRD were used and sodium hypophosphite were on copper directly without being used as the reducing agent, was catalyzed before electroless nickel sodium hypophosphite on deposited rate and phosphorus content was stud-ied to characterize the morphologies of Ni-P coating. EDS was used to deter-mine phosphorus content. Reaction mechanism of electroless nickel plating was studied.
出处
《电镀与精饰》
CAS
2008年第3期5-8,共4页
Plating & Finishing
关键词
化学镀NI-P合金
水合肼
次磷酸钠
催化
electroless Ni-P alloy plating
hydrazine
sodium hypophosphite
catalysis
