摘要
介绍了化学镀镍和镍 /金技术以及镍 磷层的电学性能 ,综述了其在倒装芯片凸焊点的UBM、印刷电路板和电感 电容 电阻LCR元件生产上的应用。展望了化学镀镍技术在微电子领域中的应用前景。
The technologies of electroless Ni & Ni/Au plating and the electric properties of Ni/P cladding are presented. Their applications for under bump metallurgy (UBM) for flip chip bumping, PC boards and LCRs are reviewed. The application prospects of electroless Ni plating in microelectronic field are described.
出处
《电镀与环保》
CAS
CSCD
2003年第4期7-9,共3页
Electroplating & Pollution Control
