摘要
介绍了化学镀镍工艺的基本原理、化学镀镍合金层的物理和化学性质及其研发现状。重点阐述了化学镀镍技术在微电子领域的应用,包括UBM制作、印制电路板表面终饰工艺和LCR元件制造,以及在计算机存储领域的应用。指出,减少污染、延长镀液使用寿命、降低成本仍然是化学镀镍面临的一项长期的任务;其在微电子领域中的镍镀层的多功能化、镀层高密度化存储、纳米微粒掺杂新型功能性镀层等更深层次的需求有着广阔的发展前景。
The fundamental, physical and chemical properties of electroless Ni are presented in the paper. The application and prospect of electroless Ni plating in the field of microelectronic device and computer storage are described. Some typical applications in under bump metallurgy （UBM） for flip chip bumping, PC boards, LCRs and computer hard disk are reviewed. It was pointed out the objective in the future is reducing pollution, prolonging the service life, and cutting down the cost.
出处
《稀有金属快报》
CAS
CSCD
2007年第3期1-6,共6页
Rare Metals Letters
基金
安徽省自然科学基金项目资助(050440603)
关键词
化学镀镍
微电子
计算机存储
electroless Ni
microelectronic
computer storage
