4Nysaether J B,Lai Z,Liu J.Thermal Cycling Lifetime of Flip Chip on Board Circuits with Solder Bumps and Isotropically Conductive Adhesive Joints[J].IEEE Trans Advanced Packaging,2000,23(4):743～749. 被引量：1
5Périchaud M G,Delétage J Y,Frémont H,et al.Reliability Evaluation of Adhesive Bonded SMT Components in Industrial Applications[J].Microelectronics and Reliability,2000,40(7):1227～1234. 被引量：1
6Liu J,Gustafsson K,Lai Z H,et al.Surface Characteristics,Reliability and Failure Mechanisms of Tin/Lead,Copper and Gold Metallization[J].IEEE Transactions on Components Packaging and Manufacturing Technology-Part A,1997,20(1):21～30. 被引量：1
