摘要
为了满足航天电子产品接插件与接地柱/金属基体之间的接触电阻高标准要求(小于5mΩ,常规20~60mΩ),本文采用类比法,从表面处理、设计安装方式和装配力矩等方面研究影响接触电阻的关键因素。结果表明,装配力矩是影响航天电子产品接插件与接地柱/基体之间接触电阻的关键因素,表面处理和设计安装方式是影响航天电子产品接插件与接地柱/基体之间接触电阻的次要因素。设置合理的力矩值是中国电科10所保证航天电子产品接触电阻小于5mΩ的关键技术,该项工艺技术已成功应用到多个航天星载项目,接触电阻一次性合格率由20%提高至100%,满足用户设计指标要求。
In order to meet the high standards of contact resistance between connectors and grounding column or metal substrate(less than 5 mΩ,general 20~60 mΩ),the influencing factors on contact resistance have been researched from surface treatment、installation and assembly torque by analogy method. The results showed that the key factor affecting the contact resistance is assembly torque, Secondary factors are surface treatment and installation. Reasonable assembly torque is the key technology to ensure that the contact resistance between connectors and grounding column or metal substrate is less than 5 mΩ. The process technology has been successfully applied to a number of aerospace projects,disposable pass rate of contact resistance increased from 20% to 100%,meeting the design requirements.
作者
胥冬琴
XU Dong-qin(Southwest China Institute of Electronic Technology,Chengdu 610036,China)
出处
《电子设计工程》
2019年第15期153-156,165,共5页
Electronic Design Engineering
关键词
接触电阻
表面处理
装配力矩
导电氧化
contact resistance
surface treatment
assembly torque
conductive oxidation
