摘要
由于BGA封装芯片的I/O引脚数目多、所占空间小,得到了广泛应用。在长期服役过程中BGA芯片受到复杂的热、电、力作用使焊球产生疲劳失效,特别是在航空航天等高可靠性产品领域。通过温度加速度试验模拟了产品的工作年限,找到了有效的工艺改进方法。
BGA packaging chip has been widely used because of its large number of I/O pins and small space.In the long-term service,BGA chip is subject to complex heat,electricity and force,which causes fatigue failure of soldering ball,especially in aerospace and other high reliability products.Through the temperature acceleration test,the working life of the product is simulated,and the effective process improvement method is found.
作者
李九峰
LI Jiufeng(Luoyang Research Institute of Electro-optical Equipment of AVIC,Luoyang 471009,China)
出处
《电子工艺技术》
2020年第4期218-221,共4页
Electronics Process Technology
关键词
CBGA
热疲劳
组装工艺
置换锡球
CBGA
thermal fatigue
assembly process
replacement of soldering ball
