摘要
通过对加强型(Stiffener)与盖型(Lid)两种2.5D封装BGA芯片进行焊接工艺与板级焊点可靠性验证,揭示了2.5D芯片特征参数对焊接与可靠性的影响机理,提出了对芯片内部热膨胀系数、共面度和动态翘曲的控制要求,并给出焊接工艺的改善方案。
Through the verification of soldering process and solder joints reliability of two kinds of 2.5D BGA chips,stiffener and Lid,the influence mechanism of 2.5D chip characteristic parameters on soldering and reliability is revealed.The control requirements of thermal expansion coefficient,coplanarity and dynamic warpage are proposed,and the improvement of soldering process is given.
作者
马军华
贾忠中
李一鸣
梁剑
李丹霞
孙瑜
MA Junhua;JIA Zhongzhong;LI Yiming;LIANG Jian;LI Danxia;SUN Yu(Zhongxing Telecommunication Equipment Corporation,Shenzhen 518057,China)
出处
《电子工艺技术》
2020年第4期245-248,共4页
Electronics Process Technology
