摘要
BGA封装器件具有较高的密度,而且具有高性能、多功能及高I/O引脚封装特点,是目前使用最为广泛的器件种类之一。但军工生产为追求产品的更高可靠性,目前还是以有铅锡膏生产为主,主流芯片都是无铅化,所以决定了军品混铅生产的必要性。文章从有铅和无铅焊料温度特性展开分析,结合有铅焊料和无铅BGA混合组装工艺中的难点部分、生产存在问题提出焊接工艺要求及注意事项等内容。另外,通过采取合理的试验,阐述混合组装焊点的可靠性和稳定性,为有铅锡膏生产过程提供更有价值的指导意义。
Ball Grid Array package devices have high density,high performance,versatility and high I/O pin package characteristics,and are one of the most widely used device types.However,in order to pursue higher reliability of products,military production is still dominated by lead-based solder paste.The mainstream chips are lead-free,which determines the necessity of mixed lead production of military products.The article analyzes the temperature characteristics of leaded and lead-free solders,combines the difficult parts of the lead-solder and lead-free BGA hybrid assembly process,and has problems in production,welding requirements and precautions.In addition,by taking reasonable tests to illustrate the reliability and stability of the hybrid assembly solder joints,it provides more valuable guidance for the lead solder paste production process.
作者
刘添福
Liu Tianfu(Guangzhou Haige Communication Group Co.,Ltd.,Guangzhou 510000,China)
出处
《无线互联科技》
2019年第7期119-120,共2页
Wireless Internet Technology
