摘要
有铅焊料焊接无铅元器件的混装工艺是目前军事电子中迫切需要进行研究的课题。通过对两组混装焊接工艺中无铅焊球和有铅焊料的可靠性分析,得出回流峰值温度为220℃～230℃,液相线(204℃)以上时间大于60 s的回流曲线焊接工艺能较好完成有铅焊料对无铅FBGA的焊接。
The Mixed Assembly technology of Sn/Pb solder paste soldering lead-free devices is an urgent research topic in military electronics. Through the reliability analysis of lead-free solder balls and Sn/Pb solder paste in two groups of mixed soldering process, it is concluded that the reflow soldering process with lead solder paste to lead-free FBGA can be successfully completed by reflow peak temperature of 220 ~230 ℃ and the time above liquidus (204 ℃) greater than 60 s.
作者
邹嘉佳
孙晓伟
程明生
ZOU Jiajia;SUN Xiaowei;CHENG Mingsheng(The 38th Research Institute of CETC,Hefei 230031,China)
出处
《电子工艺技术》
2019年第2期72-76,共5页
Electronics Process Technology
基金
总装备部十二五国防预研项目(5130706301)
关键词
FBGA
混装
焊球
回流焊温度
FBGA
mixed assembly
soldering ball
solder-reflow temperature
