摘要
采用自制的压入蠕变装置,研究了共晶型Sn-3.7Ag-0.9Zn无铅钎料合金在333~418K,压入应力为34.1-75.3MPa时的压入蠕变性能,并获得其稳态压入蠕变速率的本构方程;利用XRD和SEM对合金蠕变前后的成分和微观组织进行了分析。结果表明：Sn-3.7Ag-0.9Zn无铅钎料合金的应力指数n为4.6,蠕变激活能Qc为82.03kJ/mol,材料的结构常数A为1.74×10–5,其压入蠕变机制主要是由位错攀移运动控制的蠕变;金属间化合物Ag3Sn、AgZn提高了合金的抗压入蠕变性能。
The impression creep property of eutectic Sn-3.7Ag-0.9Zn lead-free solder alloy was studied by using self-making impression apparatus in the temperature range of 333~418 K and under the impression stress range of 34.1~75.3 MPa, and gainned the constitutive equation of its steady impression creep rate. The compositions and microstructure of the alloy before and after creep were analyzed by XRD and SEM. The results show that the stress exponent n is 4.6, creep activation energy Qc is 82.03 kJ/mol and the material structure constant A is 1.74×10–5. The impression creep mechanism of Sn-3.7Ag-0.9Zn lead-free solder alloy is mainly dislocation climbing motion control. The intermetallic compounds （IMC） Ag3Sn and AgZn increase impression creep resisting property of the alloy.
出处
《电子元件与材料》
CAS
CSCD
北大核心
2010年第10期61-64,共4页
Electronic Components And Materials
基金
四川省教育厅重点培育资助项目(No.07ZZ033)
西华大学材料加工工程省级重点学科基金资助项目
