摘要
化学镀镍镀钯浸金(ENEPIG)具有良好的综合性能,广泛应用于印制板生产领域。文章研究了在LTCC基板表面银导体上的ENEPIG工艺,通过工艺试验,确定了化学镀工艺参数,并对化学镀工艺进行了改进,通过调整工艺,增加钯层和金层厚度,解决了高温焊接后金层发白,键合可靠性差的难题,测试了LTCC基板镀层厚度、可焊性、金丝键合拉力,均满足产品应用需求。
ENEPIG have comprehensive good properties and are widely used in the field of printed circuit board production.This paper studied ENEPIG in the LTCC substrate palladium silver conductor on the process test,determined the chemical plating process,number.The forging process was improved.By adjusting the process,increasing the thickness of palladium and gold layer,it solved the high temperature of welding layer pale problem and poor reliability defect.It tested the LTCC substrate coating thickness,weld ability,wire bonding force,and the products could meet the products application requirements.
作者
王颖麟
李俊
Wang Yinlin;Li Jun(The 2th Research Institute of CETC,Taiyuan,China,030024)
出处
《印制电路信息》
2020年第7期49-54,共6页
Printed Circuit Information
