摘要
根据双面腔LTCC基板的结构特点,对其进行了分类。在介绍LTCC带腔基板的加工制造流程基础上,阐述了双面腔LTCC基板制造的三种方案。结合实验测试结果,对比分析了每个方案的优缺点和适用范围,最后指出双面腔制造方案要结合结构特点和设备条件进行优选。
Based on the structural features, the Double-face cavities in Low-Temperature Co-fired Ceramic （LTCC） substrate are classified. After introducing the fabrication procedure of the LTCC substrate with cavities, illustrate three manufacturing schemes for LTCC Double-face cavities. The merits and demerits of each scheme are analyzed experimentally. Then, the suitable scope of each scheme is summarized. Finally, point out that the selection of the manufacturing scheme needs to refer to the structural features and the equipment conditions.
出处
《电子工艺技术》
2014年第3期151-153,177,共4页
Electronics Process Technology
关键词
低温共烧陶瓷
双面腔体
平整度
Low-Temperature Co-fired Ceramic （LTCC）
Double-face cavities
Flatness
