摘要
分析了高硅铝合金激光焊接中存在的问题,通过试验确定了高硅铝合金盒体的结构设计规范和焊接工艺参数,并在小批量生产过程中,气密性满足GJB548B-2005的要求,成品率大于98%,对国产高硅铝合金的推广和应用具有一定的指导意义。
The problems in laser welding of high silicon aluminium alloy were analyzed. The structural design specification and welding parameters of high silicon aluminium alloy box were determined by experiments. The air tightness meets the requirements of GJB548B-2005 in the low-volume production, and the yield is more than 98%. It is of great significance to the popularization and application of high silicon aluminium alloy made in China.
作者
黄新临
HUANG Xinlin(Chengdu OPTO Electronics Co.Ltd.,Chengdu 610051,China)
出处
《电子工艺技术》
2018年第5期293-296,303,共5页
Electronics Process Technology
关键词
高硅铝合金
激光焊接
气密性
漏率
high silicon aluminum alloy
laser welding
air tightness
leakage rate
