摘要
采用有限元软件MSC.Marc对高硅铝合金盒体焊接残余应力和真空服役状态下的内压应力进行分析,提出了封装盒体的优化设计方法.考察了盒体形状、尺寸和盖板厚度对内压应力的影响规律,结果证明,内压应力随着短边边长的增大而增大,随着盖板厚度的提高而减少,基本不受长边边长变化的影响,指出窄长型盒体是提高盒体面积和降低内压应力进而提高可靠性的发展方向.分析了试验用盒体的内压应力和残余应力叠加后的服役应力特点并进行了可靠性分析,指出内压应力和焊接应力的最大应力不在同一方向上,叠加后的等效应力小于两者加和.讨论了盒体的极限尺寸,验证了试验用盒体服役状态下是可靠的.
Residual stress after seal welding and stress by internal pressure in vacuum environment of T / R box are analyzed using finite element analysis software MSC. Marc. Optimum design method is provided afterward. Effects of shape of box,length of sides and thickness of cover plate on stress by internal pressure are investigated. Effect of stress by internal pressure on welding residual stress is analyzed as well. Reliability and the limit size of the T / R box are discussed afterward. Results shown that stress by internal pressure increases by the increasing of short length and the decreasing of thickness of cover plate. The change of long length has almost no effect on stress by internal pressure.
出处
《焊接学报》
EI
CAS
CSCD
北大核心
2016年第5期19-22,129-130,共4页
Transactions of The China Welding Institution
基金
科工局成果管理与推广项目(JSCG2015203B001)
安徽省自然科学基金资助项目(1608085QE101)
关键词
有限元分析
封焊
应力
优化设计
finite element analysis
seal welding
stress
optimum design
